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     Thermosyphon are heat-transfer devices that are used to move heat energy from one medium to another. They are often used in a wide range of applications, including heat exchangers, cooling systems, and heating systems.

     The principle of a thermal syphon is based on the laws of thermodynamics. It uses the tendency of hot liquid to rise and cold liquid to sink, creating a continuous flow of hot and cold liquids through the device. The hot liquid rises and mixes with the cold liquid, transferring heat energy to it. The cooled liquid then sinks back to the bottom of the syphon and repeats the process.

     thermosyphon have several advantages over other heat-transfer methods. Firstly, they can achieve efficient heat transfer without the need for expensive equipment or external power sources. Secondly, they are self-regulating and require minimal maintenance. Finally, they are suitable for use in a wide range of applications, including those that require high-temperature or corrosive environments.

  Step 1 Evaporation: After the CPU heating end absorbs heat, the refrigerant (R134a) inside the evaporator absorbs heat,

            Evaporate nodules inside the evaporator, transitioning from liquid to gas.

  Step 2 Heat transfer: After vaporization, the steam is designed to flow through the evaporator (high-pressure, evaporator) due to pressure difference

              Transferred to the condenser (low pressure, Condenser).

  Step 3 Condensation: After vaporization, the vapor is cooled by the fins through air cooling, and after vaporization, the vapor condenses and becomes liquid.

  Step 4 Reflux: By gravity, the liquid flows back to the evaporator through the condenser and design pipeline, completing a cycle

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