Focus On Connecting And Cooling
A majority of heat sink currently in production are
made using finned aluminum extrusions. Aluminum is lightweight, has high
thermal conductivity and is easily customized & machined to fit a wide
variety of applications. Recent improvements in extrusion tooling and pressing
processes allow far greater fin density, more cooling surface, than was
available just a few years ago. Increased cooling surface with proper air flow
reduces semiconductor junction temperatures, increase power output and increases
system life.